Ansys’ latest 2025 R1 release equips engineering organizations with cutting-edge tools for rigorous digital design and successful product launches. At its core, Ansys 2025 R1 boasts groundbreaking advancements in fundamental physics-based solutions seamlessly integrated across engineering disciplines. By harnessing the power of AI, enhanced solvers, and platform-level tools facilitate more efficient design exploration and deliver deeper insights, revolutionizing how teams can tackle complex engineering challenges.
Digital engineering is no longer a futuristic concept—it’s the key to innovation. Ansys 2025 R1 empowers engineers with the tools and technologies they need to excel. This release integrates AI, GPU acceleration, and advanced system-level modeling to deliver faster, more accurate simulation results, enabling engineers to tackle the most challenging design problems and bring groundbreaking products to market faster.
Key Highlights
- The Ansys SimAI™ cloud-enabled artificial intelligence solution now allows users to expand the training data to gain further insight during post-processing.
- New capabilities in the Ansys System Architecture Modeler (SAM)™ include support for SysML v2, enabling more optimized product designs and significant time savings by creating tighter connections across teams while making product requirements accessible and scalable across the engineering organization.
- CFD HPC Ultimate is a new product that enables enterprise-level computational fluid dynamics (CFD) capabilities for one job on multiple CPU cores or GPUs — without the need for additional high-performance computing (HPC) licenses.
Advanced Physics Solvers
Ensuring product performance begins with understanding the multiphysics involved, from the components to the system. The latest release from Ansys highlights new products and capabilities that deliver fast, high-fidelity, physics-based results, helping teams make informed decisions earlier in the design cycle:
- Ansys Discovery™ 3D simulation software significantly expands thermal modeling with the addition of electrothermal analysis, orthotropic conductivity, and internal fans while maintaining speed and ease of use.
- The structural analysis suite features a fully integrated solution for noise, vibration, harshness (NVH), delivering 10x faster frequency response function (FRF) calculator, vibro-acoustics mapping, optimized meshing, and mode contribution analysis.
- Ansys Electronics connects to other Ansys software products, enabling improved meshing crucial for 3D integrated circuits, automated workflow capabilities, and boosted simulation performance.
- A new Polymer FEM product utilizes high-fidelity models to capture real-world materials behavior, addressing customers’ evolving materials simulation requirements.
Cloud, HPC, and GPUs
The power of cloud computing, HPC, and GPUs is changing the speed at which modern products are engineered. Accessibility, interoperability, and scalability are the heart of this evolution, empowering customers to go beyond the limits of desktop applications to design more innovative products collaboratively. Ansys R1 highlights advancements to its GPU solvers and adds web-based, on-demand capabilities to a variety of applications:
- The Ansys Fluent® multi-GPU fluid simulation solver now supports applications with high total mesh cell counts, such as automotive external aerodynamics. This allows designers to add more parameters to refine accuracy without compromising overall simulation speed.
- Ansys CFD HPC Ultimate is a new product that enables enterprise-level CFD capabilities for one job on multiple CPU cores or GPUs without needing additional HPC licenses.
- New GPU-accelerated simulations in Ansys Lumerical FDTD™ advanced 3D electromagnetic simulation software use 50% less GPU memory and provide a 20% reduction in meshing time compared to CPUs.
- The Ansys Mechanical™ GPU-accelerated direct structural finite element analysis solver is up to 6x faster than alternative solutions and the iterative solver is 6x faster than CPU-only versions.
- Ansys Cloud Burst Compute with Discovery empowers designers to solve 1,000 design variations in 10 minutes. Parametric studies in Discovery are accelerated by 100x or more by leveraging NVIDIA GPUs.
- The Ansys Cloud Burst Compute capability provides elastic, flexible, on-demand HPC capacity for Ansys Mechanical, Fluent, and Ansys HFSS™ high-frequency electromagnetic simulation software.
Artificial Intelligence
Ansys continues to deepen its portfolio with AI-augmented technologies, bringing unparalleled speed, innovation, and accessibility to the computer-aided engineering (CAE) industry. Ansys AI allows teams to use new or previously generated data to analyze designs within minutes, rapidly train their own AI models, speed time-to-market, and reduce costs:
- Ansys has developed an intuitive, interactive tool to streamline data preparation for SimAI modeling.
- SimAI now allows users to expand the training data to gain further insight during post-processing, such as honing analysis around a specific component within a larger design.
- Ansys Electronics AI+ uses AI-driven techniques to predict resources and runtime for electronics simulations in Ansys Maxwell® advanced electromagnetic field solver, Ansys Icepak® electronics cooling simulation software, and HFSS.
- Advanced synthetic radar simulation within Ansys RF Channel Modeler™ high-fidelity wireless channel modeling software empowers the digital mission engineering community with a comprehensive training and validation dataset for ground-based AI target identification.
Connected Ecosystem
Cutting-edge R&D involves adopting design methodologies like model-based systems engineering (MBSE) and automation to keep workflows seamless and efficient. Ansys solutions are interoperable and scalable, making it easy to integrate new technologies into existing infrastructure to avoid product design disruption. Included in the Ansys 2025 R1 are enhancements that focus on MBSE capabilities and data management to make the digital transition easier:
- Ansys ModelCenter® MBSE software and SAM deliver upgraded support for SysML v2, allowing more optimized product designs and significant time savings by creating tighter connections across teams while making product requirements accessible and scalable across the engineering organization.
- ModelCenter now has improved MBSE connectivity for greater compatibility, including an enhanced Capella connector and deeper integration with Ansys SAM for intuitive search, save, and modification.
- Ansys Minerva® simulation process and data management software generic connector improvements help reduce the time and cost of implementation by standardizing how external data is brought into Minerva, allowing users to verify and resolve any conflicts before uploading. The connector also helps improve engineer productivity with new asynchronous job launch capabilities.
Additional R1 announcements
- Ansys optiSLang® process integration and design optimization software includes enhancements across interfaces, distributed computing, and more advanced algorithms, adding flexibility and performance to the design workflow.
- Ansys Granta Materials Intelligence (MI)® product collection’s integrations with CAE, computer-aided design, and product lifecycle management software now feature a unified user experience between the Granta end-user interface and the integration interfaces.
- Task-based performance improvements made to the fault tolerant meshing and watertight meshing workflows in Fluent improve meshing speeds.
- Ansys PowerX™, a new tool for power field-effect transistor (FET) and power management integrated circuit (PMIC) analysis, simulation, and optimization.
Click here to learn more about Ansys 2025 R1!
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